Filter by
The language used throughout the course, in both instruction and assessments.
Results for "packaging engineering"
L&T EduTech
Skills you'll gain: Embedded Systems, Cyber Engineering, Internet Of Things, System Programming, C (Programming Language), Automation, Process Control, Electronic Systems, Robotic Process Automation, Manufacturing Processes, Mechanical Design, Equipment Design, Hydraulics, Integration Testing, Cloud Computing, Simulations, Electronic Components, Computer Hardware, Matlab, Computer Programming
Korea Advanced Institute of Science and Technology(KAIST)
Skills you'll gain: Mechanics, Mechanical Engineering, Torque (Physics), Engineering, Engineering Analysis, Engineering Calculations, Physics, Applied Mathematics, Calculus
Duke University
Skills you'll gain: MLOps (Machine Learning Operations), Data Management, Data Quality, Technical Management, Applied Machine Learning, Data Processing, Software Development Life Cycle, Machine Learning, Data Cleansing, Technology Solutions, Data Collection, Data Science, Systems Architecture, System Design and Implementation, Continuous Monitoring, Software Versioning
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Equipment Design, Simulations, Physics, Mathematical Modeling
- Status: Free
Yale University
Skills you'll gain: Life Sciences, Liberal Arts, Environment, Creativity, Anthropology, Systems Thinking, Physical Science, Timelines, Cultural Diversity, Physics, Science and Research
Skills you'll gain: Software-Defined Networking, Computer Networking, Network Infrastructure, Network Architecture, Network Engineering, Virtualization, Cloud Computing Architecture, Virtualization and Virtual Machines, Digital Transformation
University of Colorado Boulder
Skills you'll gain: Vibrations, Mechanics, Torque (Physics), Engineering Calculations, Engineering Analysis, Differential Equations, Mechanical Engineering, Structural Analysis, Mathematical Modeling, Simulation and Simulation Software, Applied Mathematics, Advanced Mathematics, Linear Algebra, Physics, Calculus
- Status: Free
DeepLearning.AI
Skills you'll gain: Generative AI, Open Source Technology, Cloud API, Secure Coding, Computer Programming
- Status: Free
Universitat Autònoma de Barcelona
Skills you'll gain: System Design and Implementation, Digital Communications, Application Specific Integrated Circuits, Computer Architecture, Computer Systems, Computer Hardware, Algorithms, Simulations, Other Programming Languages
Arizona State University
Skills you'll gain: Engineering Design Process, Engineering Drawings, Basic Electrical Systems, Prototyping, Drafting and Engineering Design, Mechanical Drawings, Computer-Aided Design, Product Engineering, Technical Drawing, Electronic Components, Electronic Systems, Manufacturing Processes, Electronic Hardware, Electrical Wiring, Hardware Design, Manufacturing and Production, Mechanical Engineering, Embedded Systems, Machine Controls, 3D Modeling
- Status: Free
École Polytechnique
Skills you'll gain: Physics, Mechanics, Semiconductors, Linear Algebra, Probability, Electrical Engineering, Calculus, Differential Equations, Advanced Mathematics, Mathematical Modeling, Experimentation
Pontificia Universidad Católica de Chile
Skills you'll gain: Electronic Systems, Electronic Components, Basic Electrical Systems, Electrical Engineering, Engineering Design Process, Schematic Diagrams, Performance Testing, Engineering Analysis, Mathematical Modeling
In summary, here are 10 of our most popular packaging engineering courses
- CPS solution for Industries:Â L&T EduTech
- Rigid Body Dynamics:Â Korea Advanced Institute of Science and Technology(KAIST)
- Managing Machine Learning Projects:Â Duke University
- Nanophotonics and Detectors:Â University of Colorado Boulder
- Journey of the Universe: The Unfolding of Life:Â Yale University
- Intel® Network Academy - Network Transformation 101: Intel
- Kinetics: Studying Spacecraft Motion:Â University of Colorado Boulder
- Prompt Engineering with Llama 2&3:Â DeepLearning.AI
- Sistemas Digitales: De las puertas lógicas al procesador: Universitat Autònoma de Barcelona
- Rapid Prototyping and Tooling:Â Arizona State University